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New preheat hot plate for PCB repair and assembling. * Fast heat up, 10 seconds to reach 250°C. * Built in temperature sensor for stable temperature control. * Hot and cool air selection for chip preheating or cooling. * Used together with a hot air rework station and fixture for BGA and other IC's. * Temperature: 120°C to 250°C(at nozzle). * Air volume: 0.18 cubic meter/min. * Size: 100(W)x60(H)x170(D)mm. Test it in our Los Angles showroom. Call (***)670-9023 to make arrangement. (Smt/smd preheat hot plate is the responsibility of Andre Mclean) |
a-mclean@cedar--rapids.com (Andre Mclean) for more information.
